Thermal and mechanical properties of Cu-Au intermetallic alloys

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Abstract

The thermal and mechanical properties of Cu, Au pure metals and their ordered intermetallic alloys of Cu3Au(L12), CuAu(L1 0) and CuAu3(L12) are studied by using the molecular dynamics simulation. The effects of temperature and concentration on the physical properties of CuxAu1-x are analysed. Sutton-Chen (SC) and quantum Sutton-Chen (Q-SC) many-body potentials are used. The simulation results such as cohesive energy, density, elastic constants, bulk modulus, heat capacity, thermal expansion, melting points and phonon dispersion curves are in good agreement with the available experimental data at the various temperatures. Q-SC potential parameter results are usually closer to experimental values than the ones predicted from SC potential parameters. © 2005 IOP Publishing Ltd.

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Keywords

Alloys, Aluminum alloys, Computer simulation, Concentration (process), Copper alloys, Corrosion resistance, High temperature effects, Melting, Molecular dynamics, Oxidation, Specific heat, Thermal expansion, Thermodynamic properties, Molecular dynamics simulation, Quantum Sutton chen (SC) many-body potentials, Second moment approximation (SMA), Tight binding (TB), Intermetallics, Quantum Sutton chen (SC) many-body potentials, Second moment approximation (SMA), Intermetallics, Concentration (process), Corrosion resistance, High temperature effects, Melting, Tight binding (TB), Computer simulation, Molecular dynamics, 530, Aluminum alloys, Thermodynamic properties, Copper alloys, Oxidation, Molecular dynamics simulation, Alloys, Specific heat, Thermal expansion

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02 engineering and technology, 01 natural sciences, 0103 physical sciences, 0210 nano-technology

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37

Volume

13

Issue

5

Start Page

657

End Page

669
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34

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33

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62

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